Description

Test mode:

Optimized detection technology covering the whole circuit board. Jointed board and multiple marks, with Bad Mark function.

Detection type: 

Component defects such as whether there is solder paste, offset, insufficient solder, excess solder, open circuit and contamination;

mounting defects such as missing part, offset, skewing, tombstone, mounting on side, turnover, wrong parts, damage and reversal, etc.;

solder joint defects such as excess solder, insufficient solder, pseudo soldering, and solder bridge, etc.;

and PCB defects such as copper foil contaminated, black pad, de-lamination, copper foil missing, and oxidation, etc.

Image recognition: 

Automatically set the parameters (e.g. shift, polarity, short circuit, etc.) according to different inspection requirements.

SPC statistical function: Record the test data in the whole process and carry out statistics and analysis, and production status and quality analysis can be viewed in any area.

Camera and lighting system:

Full-color high-speed digital CCD camera, with resolution of lens of 10, 15, 18 and 20um, three-channel RGB light source.

Driving system: 

AC servomotor system, precision grinding ball screw.

Specification