Feature

Inspection system Application: After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.

Inspection Items:

1) Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.

2) Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.

3) DIP: Missing parts, damage parts, offset, skew, inversion, etc

4) Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.

Calculation Method: Machine learning, color calculation, color extraction, gray scale operation, image contrast.

Inspection mode: PCB fully covered, with array and bad marking function.

SPC statistics function: Fully record the test data and make analysis, with high flexibility to check production and quality status.

Optical system:

Camera: 5 million pix full color high speed industrial digital camera ,20 million pix camera optional.

Lens resolution: 10um/15um/18um/20um/25um, can be custom-made.

Lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional.

Minimum component: 0201 chip, 0.3 pitch IC.

Specification