Feature

Selective spray flux: according to the PCB structure, the user can edit the program to plan the X-Y movement path of the spray flux.

Selective wave soldering: Selectively soldering the PCB according to the user's program path X-Y-(Z).

Tin furnace: patent square nozzle design, furnace bladder anti-corrosion treatment; High temperature motor drive, fully enclosed impeller, low design; Electromagnetic pump tin stove is optional.

Manipulator + motion control: the movement of PCB relative to tin stove adopts X-Y-(Z) right-angle manipulator, servo/stepper motor drive; Ball screw + linear guide way; Motion control card, path and add/subtract speed control.

Programmer: can be flexible to copy, edit and save the program, Flux spray and solder use the same procedure.

Preheating: Preheating temperature, preheating time, preheating path program can be adjusted, users can flexibly use infrared + hot air preheating process;

Nitrogen system: with nitrogen pressure adjustment, flow control, advance heating, nitrogen cap.(option)

Equipment operation: single person (or robot) to take and put the board operation.

Specification