NeoDen T20L Reflow Oven
Inside reflow oven is a heating circuit that heats air or nitrogen to a temperature high enough to blow into the printed circuit board, allowing the solder on either side of the component to melt and bond to the motherboard.
Specification
|
Model |
ND T20L |
|
Belt Width(mm) |
400 |
|
Available max. height of component |
<30mm |
|
Max Speed of Conveyor (mm) |
<1200mm/min |
|
Noise intensity |
75db |
|
Temperature preheating time |
15min |
|
Temperature range control |
room temperature~ 400℃ |
|
Temperature accuracy |
+/-1℃ |
|
Temperature distributing deviation on PCB |
+/-2℃ |
|
Temperature preheating time |
15min |
|
Length*Width*Height (mm) |
4800*900*1250mm |
|
Net Weight |
800KG |
|
Gross Weight |
870KG |
