PCBA Processing: Key Differences and Applications of reflow oven vs. Wave Soldering machine

In PCBA processing, reflow soldering oven and PCB wave soldering machine are two common soldering technologies. They play an important role in the welding process of electronic components, but the applicable scenarios and process characteristics are different. This article will discuss in detail the role of reflow and wave soldering and its main differences.

I. Understand solder reflow oven

1. What is solder reflow oven?

Reflow oven is through the heating of pre-coated in the pad on the solder paste, so that it melts and mounted on the PCB with electronic components on the pins or solder end of the formation of electrical connection process. Reflow soldering is usually divided into preheating zone, heating zone and cooling zone to ensure the quality of soldering.

2. Solder reflow oven process

SMT manufacturing line process includes the following steps:

Solder paste printer printing: Accurately print solder paste onto the pads of the PCB through a stencil.

Placement of components: Use the SMT machine to place surface mounted components on the pads.

Reflow: The PCB is fed into a reflow oven where the solder paste melts at high temperatures and forms a solder joint.

Cleaning: The PCB is cleaned to remove residual flux or other contaminants.

3. Features

The solder paste is coated on the pads before soldering, and only needs to be heated and melted when soldering.

Suitable for high-density, miniaturized PCB design, especially surface mount components.

The soldering temperature profile is divided into three stages: preheating, heating and cooling to ensure soldering quality.

4. Common applications of reflow soldering oven

Consumer electronics: Production of smart phones, tablets and other consumer electronics devices. These products usually require highly integrated and small-sized components, and reflow soldering can meet these requirements.

Computer Hardware: In computer motherboards and other hardware, reflow is used to connect a variety of surface mount components such as processors, memory modules and other integrated circuits to ensure good electrical connections and signal integrity.

Communications Equipment: In communications equipment such as routers and switches, reflow soldering is used to mount high-speed channels and wireless modules, providing a reliable soldering solution to support high-frequency signal transmission.

Automotive electronics: Especially in the production of safety systems, engine control units (ECUs) and entertainment systems.

 

II. Understand wave soldering machine

1. What is wave soldering machine?

Wave soldering is through the pump machine will melt the solder jet into the solder wave, and then the PCB pin component pins through the solder wave, to achieve the electrical connection between the component and the PCB. Wave soldering equipment usually includes four parts: spraying, preheating, soldering oven and cooling.

2. Process flow

The typical flow of wave soldering is as follows:

Insertion: Insert the pin component (THT) into the through-hole of the PCB.

Apply Flux: Spray flux on the bottom of the PCB to remove oxidized layer and enhance solder wettability.

Preheat: Preheat the PCB to minimize thermal shock and activate the flux.

Wave Soldering: Pass the PCB through a wave of solder, where the solder forms a connection with the component pins and pads.

Trimming: Remove excess pins.

Inspection: Check the quality of soldering.

3. Characteristics

Solder is applied to the pads through the wave crest during the soldering process.

It is suitable for pin components (THT) and larger size PCBs.

4. Common applications of wave soldering machine

Soldering of through-hole components: Such as resistors, capacitors, connectors and other plug-in components. These components are soldered to PCBs through holes, and wave soldering enables fast and efficient soldering to ensure reliable electrical connections.

Mixed-technology boards: Commonly found in board designs that contain both surface-mounted components and through-hole components. Wave soldering machine can be used in conjunction with reflow soldering oven for efficient soldering of different types of components.

Automotive electronics: Commonly used to manufacture components that require high strength connections, such as sensors, control units and motor drive circuits. Wave soldering provides strong solder joints that ensure they can withstand the stresses of automotive vibration and environmental changes.

Appliances and industrial equipment: Widely used to weld high-power components and connectors, which often require stronger welded connections to cope with higher heat and current.

 

III. The key difference between reflow oven and wave soldering machine

1. Welding method

Reflow oven: Melting of pre-coated solder paste by high-temperature hot air or infrared heating.

Wave soldering machine: Through the molten solder wave directly contact the component pins for welding.

2. Solder Distribution

Reflow oven: Solder paste has been coated on the pad before soldering, and only needs to be heated and melted when soldering.

Wave soldering machine: The solder is applied to the pads through the wave during the soldering process.

3. Applicable Components

Reflow oven: mainly used for surface mount components (SMT), such as resistors, capacitors, integrated circuits and so on.

Wave soldering machine: mainly used for pin components (THT), such as connectors, sockets and so on.

4. Process complexity

Reflow oven: relatively simple process, suitable for high-density, miniaturized PCB design.

Wave soldering machine: process is more complex, suitable for larger size PCB and pin components.

 

Summary

Through the discussion in this paper, we can clearly recognize the importance of reflow soldering machine and wave soldering of the two welding technologies in the PCBA processing. Each soldering method has its own unique advantages and applicable scenarios, to understand these characteristics can help manufacturers in different product requirements to make a wise choice.

Reflow oven, with its high precision and ability to adapt to complex assemblies, has taken an important role in the production of modern electronic devices, especially when dealing with fine-pitch and highly integrated components. Wave soldering machine, on the other hand, remains the ideal choice for mixed-technology boards due to its ability to efficiently solder through-hole components and its advantages in mass production.

When choosing a soldering method, we PCBA manufacturers should carefully evaluate our respective specific needs, including product type, production scale, component type, and budget. This will help ensure a smooth production process and improve the quality and reliability of the final product.

Company Profile

1. Established in 2010, 200+ employees, 27,000+ Sq.m. factory.
2. NeoDen products: Smart series PNP machine, NeoDen N10P, NeoDen9, NeoDen K1830, NeoDen4, NeoDen3V, NeoDen7, NeoDen6, TM220A, TM240A, TM245P, reflow oven IN6, IN12, IN12C, Solder paste printer FP2636, PM3040.
3. Successful 10000+ customers across the globe.
4. 40+ Global Agents covered in Asia, Europe, America, Oceania and Africa.
5. R&D Center: 3 R&D departments with 25+ professional R&D engineers.
6. Listed with CE and got 70+ patents.
7. 30+ quality control and technical support engineers, 15+ senior international sales, timely customer responding within 8 hours, professional solutions providing within 24 hours.

2025-04-27 09:01
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